10 Questions You Should to Know about Panasonic Smt Feeder

A Practical Guide to Surface Mount Technology (SMT) Covering Solder Paste, Reflow, Components, and Process Control

1. Standard SMT workshop temperature is 25°C ±3°C (77°F ±5.4°F).
2. Required tools for solder paste printing include: solder paste, stencil, squeegee, stencil wipes, lint-free cloth, cleaning solvent, and a paste spatula.
3. Common solder paste alloy: Sn/Ag/Cu 305 (96.5/3.0/0.5), melting point: 217°C (422.6°F).
4. Solder paste contains two main components: solder powder and flux.
5. The flux removes oxides, breaks surface tension, and prevents re-oxidation during soldering.
6. Typical volume ratio of solder powder to flux: 1:1; weight ratio: 9:1.
7. Always follow FIFO (first-in, first-out) when using solder paste. Two required steps before use: bring to room temperature and stir thoroughly.
8. For moisture-sensitive devices (MSDs), the humidity indicator card (HIC) must show blue to proceed with assembly.
9. Common stencil manufacturing methods: etching, laser cutting, electroforming, and nano-coating. Among them, laser-cut stencils are reworkable.
10. SMT stands for Surface Mount Technology – attaching electronic components directly onto the surface of PCBs.

Link to KF-SMT

11. ESD stands for Electrostatic Discharge, a critical factor in electronic manufacturing.
12. SMT machine programs generally consist of five data sets: PCB data, fiducial mark data, feeder data, nozzle data, and part data.
13. The relative humidity inside dry cabinets for MSDs should be maintained below 10% RH.
14. Common passive components: resistors, capacitors, inductors, diodes.
  Common active components: transistors, ICs.
15. SMT stencils are typically made from stainless steel, with common thicknesses being 0.12 mm or 0.15 mm.
16. Try to balance cycle times between high-speed and multi-purpose placement machines to optimize line efficiency.
17. Sources of static charge include friction, separation, induction, and conduction.
  ESD risks: device failure, contamination.
  Elimination methods: ionization, grounding, and shielding.
18. Package sizing:
 - Imperial = 0.06″ × 0.03″
 - Metric = 3.2 mm × 1.6 mm
19. Example of component markings:
 - Resistor “ERB--J81”: “4” = 4 circuits, 56Ω
 - Capacitor “ECA-Y-M31”: C = 106 pF = 0.1 nF
20. Document types:
 - ECN = Engineering Change Notice
 - SWR = Special Work Request
 These must be signed off by relevant departments and issued by document control to be valid.

21. The 5S system stands for: Sort, Set in order, Shine, Standardize, Sustain.
22. Vacuum-sealed PCB packaging helps protect against dust and moisture.
23. The “Three No” Quality Policy:
 - No receiving of defects
 - No making of defects
 - No passing on of defects
24. Quality assurance steps:
 - Understand customer needs
 - Translate needs into standards
 - Train operators
 - Audit and improve continuously
 - Ensure customer satisfaction
25. In fishbone (Ishikawa) analysis, 4M1H refers to:
 - Man, Machine, Material, Method, and Environment (H = “Huánjìng” in Chinese)

26. Solder paste composition includes:
 - Metal powder (85–92% by weight)
 - Solvent, flux, anti-slump agent, activators
27. Before use, refrigerated solder paste must return to room temperature to prevent defects such as solder balling after reflow.
28. Common SMT feeder modes: Preparation, Priority Exchange, Exchange, and Quick Exchange.
29. PCB positioning methods in SMT lines include: vacuum, mechanical holes, edge clamping, and side edge guides.
30. Resistor marking:
 - “272” = 2.7 kΩ
 - “485” = 4.8 MΩ

31. BGA component markings typically include: manufacturer name, part number, specifications, and date/lot code.
32. True definition of quality: “Getting it right the first time.”
 QC types: IQC, IPQC, FQC, OQC.
33. The fishbone diagram in quality control emphasizes cause-and-effect analysis.
34. CPK (Process Capability Index) represents the real-time performance capability of a process.
35. Flux starts evaporating and activates chemically in the preheat zone during reflow.
36. Ideal reflow profiles: cooling curve should mirror heating curve for balanced thermal stress.
37. Typical reflow soldering profile: Ramp → Soak → Reflow → Cool.
38. Most commonly used PCB substrate material is FR-4 (flame-retardant fiberglass).
39. Maximum allowed PCB warpage is 0.75% of the diagonal length.
40. Uneven heating of components during reflow may cause tombstoning, misalignment, or cold solder joints.

41. Standard BGA ball diameter used in motherboards: 0.76 mm.
42. ABS system refers to absolute coordinate systems; high-speed placers can place resistors, capacitors, ICs, transistors.
43. Ceramic chip capacitor “ECA-Y-K31” has a tolerance of ±10%.
44. Panasonic Panasert SMT machines typically operate at 3-phase, 200V ±10VAC.
45. SMT tape reel sizes are generally 13-inch and 7-inch diameter.
46. Stencil apertures are usually 4μm smaller than PCB pad to reduce solder balling.
47. BIOS = Basic Input/Output System, critical for booting and hardware control.
48. If an IC moisture indicator card shows humidity >30%, the IC is considered moisture-absorbed and compromised.
49. Correct solder paste ratio:
 - Weight: 90% solder / 10% flux
 - Volume: 50% solder / 50% flux
50. SMT originated in the mid-s, developed by military and aerospace industries.

51. Paper tape reels with 8mm width usually have a component pitch of 4mm.
 Note: “20mm” is not a valid carrier tape width.
52. In early s, HCC referred to a new SMD type: Hermetically Sealed Leadless Chip Carriers.
53. Component code “272” = 2.7 kΩ resistor;
 ”100nF” capacitor is equivalent to 0.1μF.
54. Common pick-and-place machines include:
 - In-line,
 - Rotary turret,
 - Gantry-type systems.
55. Flux types based on rosin include: R, RA, RSA, and RMA.
56. The most commonly used material for SMT components is ceramic.
57. SMT repair tools: soldering iron, hot air rework station, desoldering pump, tweezers.
58. Ideal solder pot temperature during manual soldering: 245°C (473°F).
59. Basic SMT production flow:
 Board loader → Solder paste printer → High-speed placer → Multi-purpose placer → Reflow oven → Unloader.
60. Most PCBs used in current computers are made of fiberglass-reinforced epoxy (FR-4).

61. Resistor arrays (networks) used in SMT are non-polarized.
62. Most commercial solder pastes maintain optimal tackiness for ~4 hours after application.
63. Standard air pressure for SMT equipment: 5 kg/cm² (≈ 71 psi).
 Placement rule: small components first, larger ones later.
64. For PCBs with PTH on the top side and SMT on the bottom, use dual-wave soldering with turbulence flow.
65. Common SMT inspection methods include:
 - Visual inspection
 - X-ray inspection
 - Automated Optical Inspection (AOI)

66. Heat transfer during soldering iron repairs involves conduction + convection.
67. Typical BGA solder ball composition: Sn90 / Pb10.
68. Common stencil fabrication methods: laser cutting, electroforming, chemical etching.
69. Reflow oven temperature should be set based on actual measurements via thermocouples.
70. Post-reflow, components are expected to be securely soldered onto the PCB.

71. The evolution of quality management:
 TQC → TQA → TQM
 (Total Quality Control → Assurance → Management)
72. ICT (In-Circuit Testing) uses bed-of-nails fixtures and static testing for components.
73. Static electricity has low current and is greatly affected by humidity.
74. Advantages of solder alloys:
 - Lower melting point
 - Good fluidity at low temperatures
 - Meets mechanical strength requirements
75. If reflow oven components or process settings are changed, temperature profiling must be remeasured.

76. Siemens 80F/S system uses electronic drive control.
77. Solder paste thickness testers use laser measurement to inspect:
 - Paste height
 - Thickness
 - Printed width
78. Common SMT feeding methods:
 - Vibratory feeders
 - Tray feeders
 - Tape-and-reel feeders
79. Mechanical structures used in SMT machines include:
 - Cam mechanisms
 - Linkage mechanisms
 - Screw drives
 - Sliding mechanisms
80. If visual inspection is inconclusive, refer to:
 - BOM file
 - Supplier confirmation
 - Reference board (Golden Sample)

81. For packaging marked “12w8P,” adjust pitch counter to 8 mm feed per advance.
82. Types of reflow ovens include:
 - Hot air reflow
 - Nitrogen reflow
 - Laser reflow
 - Infrared reflow
83. Sample production methods for SMT prototyping:
 - Inline automation
 - Manual printing + machine placement
 - Manual printing + manual placement
84. Common fiducial mark shapes:
 - Circle, cross, square, diamond, triangle, swastika
85. Improper reflow profiling can cause microcracks, especially in preheat or cooling zones.

The ideal mirror image relationship between the cooling zone curve and the reflux zone curve;

RSS curve is heating - constant temperature - reflux - cooling curve;

The PCB material currently used is FR-4;

PCB warpage specification does not exceed 0.7% of its diagonal;

STENCIL laser cutting is a method that can be reworked;

The diameter of the BGA ball commonly used on computer motherboards is 0.76mm;

ABS system is absolute coordinates;

The error of ceramic chip capacitor ECA-Y-K31 is ±10%;

Panasert Panasonic automatic placement machine has a voltage of 3~200±10VAC;

SMT parts packaging, its tape-and-reel diameter is 13 inches, 7 inches;

SMT general steel plate opening is 4um smaller than PCB PAD to prevent bad solder balls;

According to the "PCBA Inspection Regulations", when the dihedral angle is greater than 90 degrees, it means that the solder paste has no adhesion to the wave solder body;

After the IC is unpacked, if the humidity on the humidity display card is greater than 30%, it means that the IC is damp and absorbing;

The correct weight ratio and volume ratio of tin powder to flux in the solder paste ingredients are 90%:10%, 50%:50%;

The early surface bonding technology originated from the military and avionics fields in the mid-s;

The contents of Sn and Pb in the solder paste most commonly used in SMT are: 63Sn+37Pb;

The feeding distance of the common paper tape tray with a width of 8mm is 4mm;

In the early s, a new type of SMD in the industry was a "sealed footless chip carrier", often replaced by HCC;

The resistance value of the component with symbol 272 should be 2.7K ohms;

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The capacitance value of the 100NF component is the same as 0.10uf;

The eutectic point of 63Sn+37Pb is 183 degree Celsius;

The most used electronic component material for SMT is ceramic;

The temperature curve of the reflow furnace is the most suitable for its maximum temperature of 215C;

During tin furnace inspection, the temperature of the tin furnace is 245C;

SMT parts are packaged with a tape-and-reel reel with a diameter of 13 inches and 7 inches;

The hole pattern of the steel plate is square, triangle, round, star, and original shape;

The computer-side PCB currently in use is made of glass fiber board;

Sn62Pb36Ag2 solder paste is mainly used for what kind of substrate ceramic board;

Rosin-based flux can be divided into four types: R, RA, RSA, RMA

SMT segment exclusion with or without directionality;

The solder paste currently on the market has only 4 hours of tack time;

The rated air pressure of 7SMT equipment is generally 5KG/cm2;

. SMT equipment generally uses rated air pressure of 5KG/cm2;

PTH on the front and SMT on the back, which welding method is used when passing through the tin furnace;

SMT common inspection methods: visual inspection, X-ray inspection, machine vision inspection

The heat conduction method of ferrochrome repair parts is conduction + convection;

At present, the solder balls of BGA materials are mainly Sn90 Pb10;

Steel plate production method: laser cutting, electroforming, chemical etching;

The temperature of the arc welding furnace is as follows: Use a thermometer to measure the applicable temperature;

The SMT semi-finished products of the recirculation welding furnace are in the welding condition that the parts are fixed on the PCB when they are exported;

The development course of modern quality management TQC-TQA-TQM;

ICT test is a needle bed test;

ICT test can test electronic parts using static test;

The characteristics of soldering tin are that the melting point is lower than that of other metals, the physical properties meet the welding conditions, and the fluidity at low temperatures is better than other metals;

The replacement process conditions of the parts of the arc welding furnace need to re-measure the measurement curve;

Siemens 80F/S is a relatively electronic control drive;

The solder paste thickness gauge uses Laser light to measure: solder paste degree, solder paste thickness, solder paste printing width;

SMT parts feeding methods include vibrating feeder, disc feeder, tape feeder;

Which mechanisms are used in SMT equipment: cam mechanism, side lever mechanism, screw mechanism, sliding mechanism

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