How to Choose Semiconductor Developer Solution?

Heterogeneous integration is becoming increasingly important for achieving system-level scaling and overall semiconductor device miniaturization. Developing the next generation of advanced packaging, as well as overcoming the many challenges in this space, will require novel materials and manufacturing processes. From pathfinding to quality control and failure analysis, streamlined workflows enabled by automated solutions can help engineers accelerate the pace of innovation.

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Nanoscience Instruments provides a variety of advanced yet approachable solutions for analyzing next-generation semiconductor packaging materials and devices:

• Visualize device architecture at the micro- and nanoscale with SEM and EDS.
• Monitor and drive quality improvements with insights provided by SEM-based automated particle analysis.
• Confidently prepare artifact-free cross-sectional samples using broad-beam ion milling.
• Obtain fundamental insights into liquid-solid interfacial interactions with optical tensiometry.
• Simulate and analyze CMP processes to optimize slurry formulations and protocols

Scanning electron microscopy (SEM) is an indispensable tool in the development and failure analysis of semiconductor device packaging. Versatile imaging modes enabled by multiple detectors allow surfaces and interfaces to be visualized on micrometer and nanometer length scales with enhanced depth of focus and exceptional clarity. The wealth of data provided by SEM can be used to identify failure mechanisms such as cracks, delamination, voids, and other features that are often imperceptible through other techniques.

When combined with SEM imaging, energy dispersive X-ray spectroscopy (EDS) supercharges failure analysis capabilities. EDS analyzes the X-rays emitted from the sample as the electron beam scans the sample, allowing a high-resolution map of surface elemental composition to be visualized.

The one-click elemental analysis software available on all Phenom’s paired with the high-brightness electron source and solid-state detector allows for efficient and accurate EDS acquisition, mapping, and semi-quantitative analysis.

3D surface topography mapping involves the creation of a detailed, three-dimensional representation of a surface, allowing for unambiguous identification of peaks and valleys present on chips, substrates, or other critical packaging components. This precise microscale feature identification enables engineers to assess the quality and roughness of materials with more confidence and monitor inconsistencies in manufacturing processes.

All Phenom Desktop SEMs come standard with a 3D Roughness Reconstruction application. Made possible by the segmented backscattered electron detector (BSD), semi-quantitative 3D images and sub-micron roughness measurements can be generated from BSD images. Heat map color scales are used to represent different relative Z-heights and users can generate line scans and standard roughness metrics at the click of a button.

Cross sectioning is a commonly utilized sample preparation technique in semiconductor device failure analysis because it can reveal internal structures at suspected electrical failure locations. Broad beam ion milling ensures the highest quality of SEM data by revealing an artifact-free surface by gently, yet rapidly, milling away material. By offering a non-destructive means of accessing the device’s internal features, broad beam ion milling facilitates in-depth investigations, helping engineers pinpoint and address the issues responsible for the semiconductor’s failure.

Accurate characterization of liquid-solid interactions is paramount for semiconductor packaging R&D as it underpins the successful advancement of next-generation packaging solutions, like 2.5D and 3D IC packaging. Understanding the surface energy and wettability of materials used in semiconductor packaging is crucial for selecting appropriate surface treatments, fluxes, adhesives, underfills, and encapsulants that will ensure optimal electrical conductivity, thermal dissipation, and package reliability. Precise characterization of surface and interfacial properties aids in tailoring material interactions, ensuring proper wetting and adhesion, and minimizing defects, such as voids or delamination.

Chemical Mechanical Planarization (CMP), also referred to as Chemical Mechanical Polishing, combines chemical and mechanical processes to planarize semiconductor components. CMP is critical for creating uniform interlayer dielectric and metal layers and ensures a smooth topography for photolithography and metallization steps. A good understanding of the chemistry and surface interactions involved in CMP enables the optimization of CMP slurry formulations and process protocols for increased efficiency and better reliability and functionality of finished devices. Quartz Crystal Microbalance with Dissipation Monitoring (QCM-D) allows the simulation of CMP processes using relevant surface materials and chemicals to monitor how additives, additive mixtures, and abrasives interact with the surface of interest. Characterize slurry additive – surface interactions, study etching behavior of slurry formulas, analyze performance of cleaning agents for post-CMP residue removal, and uncover the interactions involved in CMP processes at the nanoscale with QCM-D analysis.

Semiconductor devices are now universal and have a critical role in modern-day society. Semiconductors influence how we provide entertainment, interact and communicate with the world, and enable many modern conveniences. As more services and products become connected, semiconductor devices have developed into a strategic priority, allowing development needs to evolve and prevent supply disruptions.

To meet the growing demands, scaling up has been pushed to the limit by device manufacturers while new materials and processes have been introduced, facilitating the necessary material innovations for integral semiconductor equipment. 

Semiconductor manufacturing can be separated into two halves; the “front-end”, which focuses on wafer fabrication, and the “back-end”, where integrated circuits are assembled. The manufacturing process requires very high precision using the best equipment.

This article discusses the differences between the two processes, some sealing solutions needed for back-end semiconductor processing, and their benefits. Many demanding applications require processes where the equipment is optimized to provide the highest yields possible at the lowest cost possible.

Image Credit: Omniseal Solutions

Brief Overview of Front-End Semiconductor Manufacturing

The front-end process involves numerous complex steps to transform a wafer into a finished device. This process requires oxidation, wafer cleaning, photolithography to pattern devices, and deposition, etching, doping, and metallization steps.

For process control, metrology and inspection equipment are also used. At this point, the wafers are inspected for irregularities that may cause issues with the end product. Optical techniques are used, and e-beam inspection is often required to find the smallest defects. 

Omniseal Solutions' high-performance seals are used throughout the manufacturing process and perform in challenging conditions, such as aggressive chemical and plasma environments and high temperature and ultra-high vacuum conditions.

An array of applications comprises a broad range of chemical vapor deposition, CVD, and plasma etch equipment. As well as the front-end process, we also provide precision solutions for the back-end process.

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Key Processes in Back-End Semiconductor Manufacturing

Wafer probe

This is the point in semiconductor manufacturing where devices are tested to determine whether they fit design specifications.

While still on the wafer, the semiconductors are tested using micro contacts with the circuits. Probes then measure and translate signal responses. Any semiconductors that fail are either repaired or discarded. 

Wafer dicing 

Wafer dicing is the process of slicing a semiconductor into individual die. Traditionally, this would be carried out by saw dicing. Recently, there has been a significant shift to smaller and thinner semiconductor chips, developing new techniques such as laser dicing.

Die bond

The individual die are too fragile and intricate to be handled on their own and must be safeguarded.

The Die Bond process secures the die to the substrate. The substrate then acts as the interface between the electronics manufacturing macroscopic scale and the chip’s microscopic scale. 

Wire bonding

The next step is a wire bond process. This process forms an electrical connection by fixing each pad on the die with one on the substrate using a wire. Techniques such as flip chip can also be used. 

Encapsulation

The bonded die and frame must be sealed to complete the back-end semiconductor processing. This can be achieved by attaching a sealed lid or using a molded plastic compound. At this point, the semiconductor part is ready to be used in electronics manufacturing. Final testing can be done before shipping the completed chip.

Image Credit: Omniseal Solutions

Image Credit: Omniseal Solutions

Semiconductor Sealing and Material Solutions from Omniseal Solutions

Omniseal Solutions manufactures and engineers high-performance wear and sealing solutions that are an essential part of the above back-end semiconductor manufacturing processes. These include various precision equipment, such as the SMT Dispensing and Pick & Place Test Handlers. Omniseal Solutions provides products and services that address challenges in the testing and assembly processes of back-end manufacturing. 

The company’s global business is agile, providing custom solutions across the semiconductor value chain.

Omniseal Solutions provides rapid prototyping, where the design team produces a prototype and a solution engineered to the strictest of tolerances.

The Omniseal® polymer, spring-energized seals and metal face seals are effective sealing options, as they deliver on the critical requirements of the equipment industry, such as withstanding extreme pressures and temperatures and resisting corrosive chemicals and other aggressive media.

The company also offers custom machined parts, such as CMP retaining rings and Meldin® polyimide solutions for bearings, clamp rings, and custom components.

Other benefits include:

• Low friction and wear
• Electrical insulation
• Low outgassing and high purity
• Less maintenance and downtime

The company’s semiconductor and electronics experts are available to help with application challenges. Contact the team today.

Acknowledgments

Produced from material originally authored by Thomas La Tempa from Omniseal Solutions

This information has been sourced, reviewed and adapted from materials provided by Omniseal Solutions.

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